JPS6317249Y2 - - Google Patents
Info
- Publication number
- JPS6317249Y2 JPS6317249Y2 JP10210681U JP10210681U JPS6317249Y2 JP S6317249 Y2 JPS6317249 Y2 JP S6317249Y2 JP 10210681 U JP10210681 U JP 10210681U JP 10210681 U JP10210681 U JP 10210681U JP S6317249 Y2 JPS6317249 Y2 JP S6317249Y2
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- wheel
- fixed position
- pellets
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000008188 pellet Substances 0.000 claims description 72
- 239000004065 semiconductor Substances 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000009434 installation Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 210000000078 claw Anatomy 0.000 description 2
- 239000011796 hollow space material Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10210681U JPS588944U (ja) | 1981-07-08 | 1981-07-08 | 半導体製造装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10210681U JPS588944U (ja) | 1981-07-08 | 1981-07-08 | 半導体製造装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS588944U JPS588944U (ja) | 1983-01-20 |
| JPS6317249Y2 true JPS6317249Y2 (en]) | 1988-05-16 |
Family
ID=29896758
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10210681U Granted JPS588944U (ja) | 1981-07-08 | 1981-07-08 | 半導体製造装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS588944U (en]) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59229826A (ja) * | 1983-05-31 | 1984-12-24 | Rohm Co Ltd | リ−ドフレ−ムに対する半導体ペレツトの供給装置 |
| JPS60213036A (ja) * | 1984-04-09 | 1985-10-25 | Shinkawa Ltd | チツプボンデイング装置 |
| JPH0444855Y2 (en]) * | 1987-04-06 | 1992-10-22 |
-
1981
- 1981-07-08 JP JP10210681U patent/JPS588944U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS588944U (ja) | 1983-01-20 |
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